Thermal simulation
Design office
Engineering | Product development | Tooling

Saïna, your expert in industrial thermal simulation

Saina- Spirale - Température coupe

Heat management is a critical challenge for the reliability of your systems. Are you looking to validate your cooling choices before prototyping? Saïna applies its expertise in thermal simulation to predict the temperatures of your equipment. In this way, we safeguard your designs against the risk of overheating.

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The thermal phenomena involved

Conduction

Conduction is a diffusion phenomenon that allows heat to spread within a solid, liquid or gas. It is specific to each material and is expressed by thermal conductivity.

Temperature is a function of the molecular motion within the substance. Heat conduction is therefore not possible in a vacuum.

Deregistration

This mode of heat transfer is known as ‘radiation’. It is a flow of electromagnetic waves emitted by any object, regardless of its temperature. Electromagnetic radiation is temperature-dependent: the higher the temperature, the greater the radiation, and vice versa.

This phenomenon can increase the body’s temperature when it is absorbed, or conversely, decrease it when it is emitted.

Convection

When a fluid—whether liquid or gas—flows, it carries a certain amount of thermal energy with it; this phenomenon is known as convection. There are two types of convection. Natural convection occurs when the fluid is set in motion by gravity and temperature changes. Forced convection, as the name suggests, occurs when the fluid’s movement is driven by a fan or a pump, for example.

Thermal management of electronics

The increasing miniaturization of electronic components requires controlled heat dissipation. Indeed, excessively high temperatures drastically reduce the lifespan of your printed circuit boards (PCBs).

Our engineering department creates precise models of your enclosures and components. Through simulation, we optimize:

  • The placement of heat sinks and radiators.
  • Forced ventilation or natural convection airflow.
  • The selection of thermal interface materials (TIM).

As a result, we guarantee that your junctions will remain below critical thresholds, even under severe conditions.

More information on couplings

Mechanical simulation

Saina-Bureau d'études mécanique et simulation numérique - Naval - Modal roof

Fluid simulation

Saina-Simulation fluide, aéraulique, CFD et aérodynamique

Multiphysics simulation

Modélisation de l’assemblage mécanique avec la prise en compte des conditions limites au système ainsi que, à gauche, les charges aérodynamique et à droite, les charges thermiques. Après résolution, le post-traitement de l’analyse mécanique comprenant l’ensemble des charges peu débuter. Suivants les hypothèses, des itérations d’optimisation pourront éventuellement être lancé sur ce dernier modèle.

Thermal Simulation and Analysis